FR4 Double Side Multi-Layer PCB Board Assembly Immersion Gold Printed Circuit SYF-256 manufacturer from China China PCB Board Online Market

FR4 Double Side Multi-Layer PCB Board Assembly Immersion Gold Printed Circuit

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: SYF-256

FR4 Double Side Multi-Layer Immersion Gold Printed Circuit Board Assembly <table border="1" cellpadding="0" cellspacing="0" s

FR4 Double Side Multi-Layer Immersion Gold Printed Circuit Board Assembly

PRODUCT’S DETAILS
Raw Material	FR-4 (Tg 180 available)
Layer Count	4-Layer
Board Thickness	1.0mm
Copper Thickness	2.0oz
Surface Finish	ENIG(Electroless Nickel Immersion Gold)
Solder Mask	Green
Silkscreen	White
Min. Trace Width/Spacing	0.075/0.075mm
Min. Hole Size	0.25mm
Hole Wall Copper Thickness	≥20μm
Measurement	300×400mm
Packaging	Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps
Application	Communication,automobile,cell,computer,medical
Advantage	Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements	Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable
Certification	UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB
PROCESS Engineer	ITEMS Item	PRODUCTION CAPABILITY Manufacturing Capability
Laminate	Type	FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON
Laminate	Thickness	0.23.2mm
Production Type	Layer Count	2L-16L
Production Type	Surface Treatment	HAL,Gold Plating,Immersion Gold,OSP, Immersion Silver,Immersion Tin,Lead Free HAL
Cut Lamination	Max. Working Panel size	1000×1200mm
Inner Layer	Internal Core Thickness	0.12.0mm
	Internal width/spacing	Min: 4/4mil
	Internal Copper Thickness	1.0~3.0oz
Dimension	Board Thickness Tolerance	±10%
Dimension	Interlayer Alignment	±3mil
Drilling	Manufacture Panel Size	Max: 650×560mm
	Drilling Diameter	0.25mm
	Hole Diameter Tolerance	±0.05mm
	Hole Position Tolerance	±0.076mm
	Min.Annular Ring	0.05mm
PTH+Panel Plating	Hole Wall copper Thickness	20um
PTH+Panel Plating	Uniformity	90%
Outer Layer	Track Width	Min: 0.08mm
Outer Layer	Track Spacing	Min: 0.08mm
Pattern Plating	Finished Copper Thickness	1oz3oz
EING/Flash Gold	Nickel Thickness	2.5um~5.0um
EING/Flash Gold	Gold Thickness	0.03~0.05um
Solder Mask	Thickness	1535um
Solder Mask	Solder Mask Bridge	3mil
Legend	Line width/Line spacing	6/6mil
Gold Finger	Nickel Thickness	120u
Gold Finger	Gold Thickness	150u
Hot Air Level	Tin Thickness	100300u
Routing	Tolerance of Dimension	±0.1mm
	Slot Size	Min:0.4mm
	Cutter Diameter	0.82.4mm
Punching	Outline Tolerance	±0.1mm
Punching	Slot Size	Min:0.5mm
V-CUT	V-CUT Dimension	Min:60mm
	Angle	15°30°45°
	Remain Thickness Tolerance	±0.1mm
Beveling	Beveling Dimension	30300mm
Test	Testing Voltage	250V
Test	Max.Dimension	540×400mm
Impedance Control	Tolerance	±10%
Aspect Ration		12:1
Laser Drilling Size		4mil(0.1mm)
Special Requirements		Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering and Gold Finger Are Acceptable
OEM&ODM Service		Yes

Quick Details

One of the largest PCB(Printed Circuit Board) manufacturers in China with over 500 staff.
One of the professional PCB manufacturers in China with 20 years’ experience.
Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.
Good quality with competitive price for all kinds of PCB manufactured by SYF.
One-stop service of PCB with assembly is supplied to our customers.
Best service with quick response is always provided for our customers.
All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver,Immersion Tin, Immersion Gold, Lead-free HASL,HAL.
Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine, CNC drilling machine,Auto-PTH line, AOI(Automatic Optic Inspection),Probe Flying Machine and so on.
BGA,Blind&Buried Vias and Impedence Control is accepted.