Place of Origin: | Zhejiang, China (Mainland) |
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High Density HDI FR4 High-tg PCB with Stack Via and Impedance
PRODUCT’S DETAILS |
|
Raw Material |
FR-4(Tg 180) |
Layer Count |
6-Layer |
Board Thickness |
2.0mm |
Copper Thickness |
2.0oz |
Surface Finish |
ENIG |
Solder Mask |
Green |
Silkscreen |
White |
Min. Trace Width/Spacing |
0.075/0.075mm |
Min. Hole Size |
0.25mm |
Hole Wall Copper Thickness |
≥20μm |
Measurement |
300×400mm |
Packaging |
Inner: Vacuum-packed in soft plastic bales |
Application |
Communication,automobile,cell,computer,medical |
Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
Certification |
UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
PRODUCTION CAPABILITY OF PCB |
||
|
ITEMS Item |
|
Laminate |
Type |
FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, |
Thickness |
0.23.2mm |
|
Production Type |
Layer Count |
2L-16L |
Surface Treatment |
HAL,Gold Plating,Immersion Gold,OSP, |
|
Cut Lamination |
Max. Working Panel size |
1000×1200mm |
Inner Layer |
Internal Core Thickness |
0.12.0mm |
Internal width/spacing |
Min: 4/4mil |
|
Internal Copper Thickness |
1.0~3.0oz |
|
Dimension |
Board Thickness Tolerance |
±10% |
Interlayer Alignment |
±3mil |
|
Drilling |
Manufacture Panel Size |
Max: 650×560mm |
Drilling Diameter |
0.25mm |
|
Hole Diameter Tolerance |
±0.05mm |
|
Hole Position Tolerance |
±0.076mm |
|
Min.Annular Ring |
0.05mm |
|
PTH+Panel Plating |
Hole Wall copper Thickness |
20um |
Uniformity |
90% |
|
Outer Layer |
Track Width |
Min: 0.08mm |
Track Spacing |
Min: 0.08mm |
|
Pattern Plating |
Finished Copper Thickness |
1oz3oz |
EING/Flash Gold |
Nickel Thickness |
2.5um~5.0um |
Gold Thickness |
0.03~0.05um |
|
Solder Mask |
Thickness |
1535um |
Solder Mask Bridge |
3mil |
|
Legend |
Line width/Line spacing |
6/6mil |
Gold Finger |
Nickel Thickness |
120u |
Gold Thickness |
150u |
|
Hot Air Level |
Tin Thickness |
100300u |
Routing |
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